Rainbow-electronics DS1486P Instrukcja Użytkownika Pobierz pdf (Strona 15)

DS1486/DS1486P

15 of 17

DS1486P

PKG INCHES

DIM MIN NOM MAX

0.920 0.925 0.930

0.980 0.985 0.990

- - 0.080

0.052 0.055 0.058

0.048 0.050 0.052

0.015 0.020 0.025

0.025 0.027 0.030

NOTE:

For the PowerCap version:

a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass though solder

reflow oriented with the label side up (“live - bug”).

b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3

(three) seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove

the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to remove

solder.

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Rainbow-electronics DS1486P Instrukcja Użytkownika Strona 15