SECTION 4
1. Configuration
1.1. Solder pads & switch configuration
Designation Default setting Feature
JP1 2-3 Xin OSC Input level voltage
1-2 : 3.3V
2-3: 1.8V
J9 2-3 Slow Clock OSCSEL
1-2: internal RC osc.
2-3: Ext crystal osc.
J14 1-2 VDDBU
1-2: Lithium 3V Battery
2-3: 1.8V from VDDCORE
J15 1-2 NAND chipselect
opened: nand chipselect not connected
closed: nand chipselect connected
SW3 on CF mode selection
on: CF interface in true ide mode
off: CF interface in memory/io mode
S1 opened Boot configuration
opened: boot from internal ROM
closed: boot from NCS0
Datasheet USG-00001-B01 13/28
Komentarze do niniejszej Instrukcji