
DS8313/DS8314
Smart Card Interface
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RECOMMENDED DC OPERATING CONDITIONS (continued)
(V
DD
= +3.3V, V
DDA
= +5.0V, T
A
= +25°C, unless otherwise noted. All specifications apply to both the DS8313 and DS8314, unless
otherwise noted in the CONDITIONS column.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CLOCK SOURCE
Crystal Frequency f
XTAL
External crystal (Note 1) 0 20 MHz
f
XTAL1
(Note 1) 0 20 MHz
V
IL_XTAL1
Low-level input on XTAL1 -0.3
0.3 x
V
DD
XTAL1 Operating Conditions
V
IH_XTAL1
High-level input on XTAL1
0.7 x
V
DD
V
DD
+
0.3
V
External Capacitance for Crystal
C
XTAL1
,
C
XTAL2
15 pF
Internal Oscillator f
INT
2.2 2.7 3.4 MHz
SHUTDOWN TEMPERATURE
Shutdown Temperature T
SD
+150 °C
RST PIN
Output Low Voltage V
OL_RST1
I
OL_RST
= 1mA 0 0.3 V
Card-Inactive Mode
Output Current I
OL_RST1
V
OL_RST
= 0 0 -1 mA
Output Low Voltage V
OL_RST2
I
OL_RST
= 200μA 0 0.3 V
Output High
Voltage
V
OH_RST2
I
OH_RST
= -200μA
V
CC
-
0.5
V
CC
V
Rise Time t
R_RST
C
L
= 30pF (Note 1) 0.1 μs
Fall Time t
F_RST
C
L
= 30pF (Note 1) 0.1 μs
Current Limitation I
RST(LIMIT)
-20 +20 mA
Card-Active Mode
RSTIN to RST Delay t
D(RSTIN-RST)
2 μs
CLK PIN
Output Low Voltage V
OL_CLK1
I
OLCLK
= 1mA 0 0.3 V
Card-Inactive Mode
Output Current I
OL_CLK1
V
OLCLK
= 0 0 -1 mA
Output Low Voltage V
OL_CLK2
I
OLCLK
= 200μA 0 0.3 V
Output High
Voltage
V
OH_CLK2
I
OHCLK
= -200μA
V
CC
-
0.5
V
CC
V
Rise Time t
R_CLK
C
L
= 30pF (Notes 1, 4) 8 ns
Fall Time t
F_CLK
C
L
= 30pF (Notes 1, 4) 8 ns
Current Limitation I
CLK(LIMIT)
-70 +70 mA
Clock Frequency f
CLK
Operational 0 10 MHz
Duty Factor C
L
= 30pF 45 55 %
Card-Active Mode
Slew Rate SR C
L
= 30pF (Note 1) 0.2 V/ns
VCC PIN
Output Low Voltage V
CC1
I
CC
= 1mA 0 0.3 V
Card-Inactive Mode
Output Current I
CC1
V
CC
= 0 0 -1 mA
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