Rainbow-electronics DAB-WLS-C21 (BlueTooth) Instrukcja Użytkownika Pobierz pdf

www.EZURiO.com

Long Range Bluetooth™ Serial Module

Bluetooth Module with Power Amplifier

Part Number: BTM402

1. General Description

EZURiO’s BISM II PA Bluetooth Serial Module is a fully integrated and qualified Class 1 Bluetooth

solution, which incorporates a power amplifier and low noise amplifier that maximises the RF link

budget to provide the greatest range of any Bluetooth Module. The module is designed for lowest cost

of integration and ownership for designers wishing to incorporate Bluetooth functionality into their

products. The module is qualified to Bluetooth Version 2.0.

The BISM II PA Bluetooth Serial Module is one of the most compact complete Bluetooth solutions,

making it ideal to integrate into handheld devices. The module includes a high sensitivity, high gain

antenna which provides excellent range. Typical open field performance provides ranges of up to

1,000 metres at transmit powers of 65mW.

The BISM II PA Module is based on Cambridge Silicon Radio’s BlueCore 04 chipset. The module

contain all of the hardware and firmware for a complete Bluetooth solution, requiring no further

components. The Module has an integrated, high performance antenna which is matched with the

Bluetooth RF and baseband circuitry. The firmware integrated into the BC04 chipset implements the

higher layer Bluetooth protocol stack, with support for applications requiring Generic Access Profile

(GAP), Service Discovery Profile (SDAP), Serial Port Profile (SPP), Dial Up Networking Profile (DUN),

Headset Profile (HSP), Hands Free Profile (HFP), File Transfer Profile (FTP) and OBEX (Client).

A virtual processor is used within the BC04 to implement an AT command processor. This interfaces

to the host system over a straight forward serial port using an extensive range of AT commands. The

AT command set abstracts the Bluetooth protocol from the host application, saving many months of

programming and integration time. It provides extremely short integration times for data oriented

cable replacement and voice applications. Firmware is also included that provides programming

support for multi-point applications. A low cost development system is available for fast product

evaluation and development.

Support is provided for low power modes that make the BISM II PA particularly applicable to battery

powered installations.

The Module can be configured so that it can be attached to a ‘dumb’ terminal or attached to a PC or

PDA for cable replacement applications.

In addition to the Bluetooth functionality, The BISM II PA Module provides access to 7 General I/O

lines and 2 analogue input lines. These can be configured to provide connection to simple devices

such as switches or LEDs without requiring any external processor. Both the GPIO and ADC lines can

be accessed either via the wired host UART connection, or remotely over the Bluetooth link.

The BISM II PA module is supplied in a small form factor pcb (22.0mm x 34.0mm x 7.6mm), that

connects to a main pcb using a 40 way Hirose connector. The interface is compatible with the BISM1

module and EZURiO’s 40 pin 802.11 modules. The BISM II PA module is Lead-free and is RoHS

compliant and supports an industrial temperature range of -10°C to +85°C.

A key feature of the design is that the module is pin and format compatible with EZURiO’s range of

802.11 wireless LAN modules. This allows designers to manufacture a single version of pcb which can

accept either a Bluetooth or an 802.11 module, greatly reducing development time to generate a

range of wirelessly enabled products. The compatible 802.11 modules are the WISMC01, which

contains a full TCP/IP stack, network drivers and a web server, and the WISMC02 which contains

wireless network drivers and a UDP stack with SLIP interface.

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Podsumowanie treści

Strona 1 - 1. General Description

Strona 2 - 2. Features

Strona 3

Strona 4 - 3. Functional Block Diagram

Strona 5 - 3.2 Pin Descriptions

Strona 6 - Electrical Specifications

Strona 7 - 3.3.2.7 Miscellaneous

Strona 8 - 4. I/O Characteristics

Strona 9 - 6. Functional Description

Strona 10 - 6.1.4 PCM CODEC Interface

Strona 11 - 7. Integrated Firmware

Strona 12 - 7.3 AT Overview

Strona 13

Strona 14 - 8. Low Power Modes

Strona 15 - Low Power Modes using Sniff

Strona 16

Strona 17 - 9. Application Examples

Strona 18 - Pure Cable Replacement Mode

Strona 19 - 9.4 Audio Cable (voice)

Strona 20 - 9.5 Oscillator Output

Strona 21 - 10. Application Information

Strona 22 - 10.4 RF Sh

Strona 23 - 10.5.1 Fixing Pillars

Strona 24 - 11. Board to Board Connector

Strona 25 - 12. Qualification

Strona 26

Strona 27 - 13. Environmental

Strona 28 - 14. Physical Dimensions

Strona 29 - 14.4 Ordering Informa

Strona 30 - 16. Development Kit

Strona 31 - 18. Disclaimers

Strona 32 - 18.2 Warranty

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